IP Library › Assignment 026628/0099
Patent Assignment
Reel/Frame 026628/0099

Assignment of Assignor's Interest

Recorded: 2011-07-21 Pages: 3
Assignors
FANG, JIANDONG
Executed: 2011-07-19
MRVOS, JAMES
Executed: 2011-07-20
Assignee
LEXMARK INTERNATIONAL, INC.
740 WEST NEW CIRCLE ROAD, BUILDING 82-1 LEGAL, LEXINGTON, KENTUCKY, 40550
Covered Property (1)
Substrate Structure for Ejection Chip and Method for Fabricating Substrate Structure
Patent: 8,678,557 →
Application: 13/187,755 →
Publication: US 2013/0021405
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 14, 2013
From: LEXMARK INTERNATIONAL, INC.; LEXMARK INTERNATIONAL TECHNOLOGY, S.A.
To: FUNAI ELECTRIC CO., LTD
Reel/Frame 030416/0001 →
Assignment of Assignor's Interest Mar 29, 2019
From: FUNAI ELECTRIC CO., LTD.
To: SLINGSHOT PRINTING LLC
Reel/Frame 048745/0551 →