Assignment of Assignor's Interest

Recorded: 2011-07-28 Pages: 3

Assignor

RICHTER, FRANZ

Executed: 2011-07-27

Assignee

THIN MATERIALS AG

ELSTERSTRASSE 23, EICHENAU, 82223, GERMANY

Covered Property (1)

Bonding Method

Patent: 8,641,859 →

Application: 13/131,756 →

Publication: US 2011/0272092

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.