Patent Assignment
Reel/Frame 026667/0596
Assignment of Assignor's Interest
Recorded: 2011-07-28
Pages: 2
Assignee
SHOWA DENKO K.K.
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 1058518, JAPAN
Covered Property
(1)
Method for Cutting Substrate and Method for Manufacturing Electronic Element
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.