Patent Assignment
Reel/Frame 026672/0640
Assignment of Assignor's Interest
Recorded: 2011-07-29
Pages: 2
Assignors
CHUANG, CHITA
Executed: 2011-07-20
CHUANG, YAO-CHUN
Executed: 2011-07-20
LIN, TSUNG-SHU
Executed: 2011-07-20
KUO, CHEN-CHENG
Executed: 2011-07-20
CHEN, CHEN-SHIEN
Executed: 2011-07-20
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Bump Structures in Semiconductor Device and Packaging Assembly