Patent Assignment
Reel/Frame 026700/0489
Assignment of Assignor's Interest
Recorded: 2011-07-22
Pages: 3
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, SOUTH, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Having Through Silicon via (Tsv) Interposer and Method of Manufacturing the Semiconductor Package