Patent Assignment
Reel/Frame 026701/0169
Assignment of Assignor's Interest
Recorded: 2011-08-04
Pages: 4
Assignors
LIN, JENG-SHYAN
Executed: 2011-07-27
YAUNG, DUN-NIAN
Executed: 2011-07-27
LIU, JEN-CHENG
Executed: 2011-07-27
WANG, WEN-DE
Executed: 2011-07-27
TSAI, SHUANG-JI
Executed: 2011-07-29
LIN, YUEH-CHIOU
Executed: 2011-08-03
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Pad Structures Formed in Double Openings in Dielectric Layers