Patent Assignment
Reel/Frame 026705/0609
Assignment of Assignor's Interest
Recorded: 2011-08-05
Pages: 4
Assignors
DAS, RABINDRA N.
Executed: 2011-05-05
MARKOVICH, VOYA R.
Executed: 2011-05-12
LAUFFER, JOHN M.
Executed: 2011-05-09
MAGNUSON, ROY H.
Executed: 2011-05-06
PAPATHOMAS, KONSTANTINOS I.
Executed: 2011-05-12
CHAN, BENSON
Executed: 2011-05-05
Assignee
ENDICOTT INTERCONNECT TECHNOLOGIES, INC.
1093 CLARK STREET, ENDICOTT, NEW YORK, 13760
Covered Property
(1)
Electrically Conductive Adhesive (Eca) for Multilayer Device Interconnects
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
May 14, 2012
From: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.; EI TRANSPORTATION COMPANY LLC; ENDICOTT MEDTECH, INC.
To: PNC BANK, NATIONAL ASSOCIATION
Reel/Frame 028230/0798 →
Assignment of Security Agreement
Mar 6, 2013
From: PNC BANK, NATIONAL ASSOCIATION
To: INTEGRIAN HOLDINGS, LLC
Reel/Frame 029938/0823 →
Security Agreement
May 6, 2013
From: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.; EI TRANSPORTATION COMPANY LLC; ENDICOTT MEDTECH, INC.; INTEGRIAN HOLDINGS, LLC
To: M&T BANK
Reel/Frame 030359/0057 →
Security Agreement
Jun 12, 2013
From: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.
To: MAINES, WILLIAM; MAINES, DAVID
Reel/Frame 030599/0918 →
Release of Security Interest
Feb 26, 2015
From: MAINES, WILLIAM; MAINES, DAVID
To: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.
Reel/Frame 035098/0968 →
Assignment of Assignor's Interest
Apr 16, 2015
From: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.
To: I3 ELECTRONICS, INC.
Reel/Frame 035442/0569 →
Assignment of Assignor's Interest
Jul 15, 2019
From: I3 ELECTRONICS, INC.
To: TTM TECHNOLOGIES NORTH AMERICA, LLC
Reel/Frame 049758/0265 →