Patent Assignment
Reel/Frame 026715/0749
Assignment of Assignor's Interest
Recorded: 2011-08-08
Pages: 4
Assignee
DUKE UNIVERSITY
OFFICE OF SCIENCE AND TECHNOLOGY, DURHAM, NORTH CAROLINA, 27710
Covered Property
(1)
METHOD AND ARCHITECTURE FOR PRE-BOND PROBING OF TSVs IN 3D STACKED INTEGRATED CIRCUITS
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.