Merger

Recorded: 2011-08-09 Pages: 3

Assignor

Executed: 2010-01-08

Assignee

UNIMICRON TECHNOLOGY CORP.

38 HSING PONG ROAD, KWEI SAN INDUSTRIAL ZONE, TAOYUAN, TAIWAN

Covered Property (1)

Package Substrate Having Electrically Connecting Structure

Patent: 8,022,530 →

Application: 12/265,305 →

Publication: US 2009/0146317

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.