Merger

Recorded: 2011-08-10 Pages: 4

Assignor

Executed: 2010-01-13

Assignee

UNIMICRON TECHNOLOGY CORP.

38, HSING PONG RD., KWEI SAN INDUSTRIAL ZONE, TAOYUAN, TAIWAN

Covered Property (1)

Packaging Substrate Structure with Electronic Components Embedded in a Cavity of a Metal Block and Method for Fabricating the Same

Patent: 8,022,513 →

Application: 12/230,273 →

Publication: US 2009/0057913

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.