Patent Assignment
Reel/Frame 026739/0705
Assignment of Assignor's Interest
Recorded: 2011-08-03
Pages: 4
Assignors
HARADA, DAISUKE
Executed: 2011-07-10
ISHIYAMA, HIROSHI
Executed: 2011-07-09
KANEKO, TAKAHISA
Executed: 2011-07-09
SUZUKI, YOSHIKAZU
Executed: 2011-07-04
Assignees
DENSO CORPORATION
1-1, SHOWA-CHO, KARIYA-CITY, AICHI-PREF., 448-8661, JAPAN
TOYOTA JIDOSHA KABUSHIKI KAISHA
1 TOYOTA-CHO, TOYOTA-SHI, AICHI-KEN, 471-8571, JAPAN
Covered Property
(1)
Method of Manufacturing Semiconductor Modules and Semiconductor Module