Patent Assignment
Reel/Frame 026741/0098
Assignment of Assignor's Interest
Recorded: 2011-08-12
Pages: 4
Assignors
YU, CHUN HUI
Executed: 2011-07-27
TUNG, CHIH-HANG
Executed: 2011-07-27
SHAO, TUNG-LIANG
Executed: 2011-07-27
YU, CHEN-HUA
Executed: 2011-07-27
SHIH, DA-YUAN
Executed: 2011-07-27
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Multi-Chip Wafer Level Package