Patent Assignment
Reel/Frame 026756/0514
Assignment of Assignor's Interest
Recorded: 2011-08-16
Pages: 4
Assignors
MAMITSU, KUNIAKI
Executed: 2011-07-03
KANEKO, TAKAHISA
Executed: 2011-07-10
TONOMOTO, MASAYA
Executed: 2011-07-13
NISHIHATA, MASAYOSHI
Executed: 2011-07-03
WADO, HIROYUKI
Executed: 2011-07-06
NORITAKE, CHIKAGE
Executed: 2011-07-04
NOMURA, EIJI
Executed: 2011-07-03
ITOH, TOSHIKI
Executed: 2011-07-04
Assignee
DENSO CORPORATION
1-1, SHOWA-CHO, KARIYA-CITY, AICHI-PREF., 448-8661, JAPAN
Covered Property
(1)
Semiconductor Package Cooled by Grounded Cooler