IP Library Assignment 026759/0072
Patent Assignment
Reel/Frame 026759/0072

Assignment of Assignor's Interest

Recorded: 2011-08-16 Pages: 10
Assignors
KIM, JI YUN
Executed: 2011-04-04
SHIN, HYUN SUB
Executed: 2011-04-04
LEE, SUNG WON
Executed: 2011-04-04
LEE, HYUNG EUI
Executed: 2011-04-04
SEO, YEONG UK
Executed: 2011-04-04
RYU, SUNG WUK
Executed: 2011-04-04
LEE, HYUK SOO
Executed: 2011-04-04
Assignee
LG INNOTEK CO., LTD.
SEOUL SQUARE, 541, NAMDAEMUNNO 5-GA, JUNG-GU, SEOUL, 100-714, KOREA, REPUBLIC OF
Covered Property (1)
Structure for Multi-Row Lead Frame and Semiconductor Package Capable of Minimizing an Under-Cut
Patent: 8,659,131 →
Application: 13/121,018 →
Publication: US 2011/0227208
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 8, 2015
From: LG INNOTEK CO., LTD.
To: ALS CO., LTD.
Reel/Frame 035598/0488 →