Patent Assignment
Reel/Frame 026762/0914
Assignment of Assignor's Interest
Recorded: 2011-08-17
Pages: 2
Assignors
WU, SHENG-YU
Executed: 2011-07-28
KUO, TIN-HAO
Executed: 2011-07-28
CHUANG, CHITA
Executed: 2011-07-28
CHEN, CHEN-SHIEN
Executed: 2011-07-28
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Dummy Flip Chip Bumps for Reducing Stress