Patent Assignment
Reel/Frame 026763/0017
Assignment of Assignor's Interest
Recorded: 2011-08-17
Pages: 3
Assignee
TOKYO ELECTRON LIMITED
3-1 AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Method of Setting Thickness of Dielectric and Substrate Processing Apparatus Having Dielectric Disposed in Electrode