Patent Assignment
Reel/Frame 026767/0582
Assignment of Assignor's Interest
Recorded: 2011-08-17
Pages: 4
Assignors
LI, CHANG-JE
Executed: 2011-06-16
WU, YI-TSUO
Executed: 2011-06-16
LIN, YEN-LIANG
Executed: 2011-06-15
YOUNG, WHU-MING
Executed: 2011-06-16
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIEN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Architecture for Supporting Modulized Full Operation Junction Ultra High Voltage (UHV) Light Emitting Diode (LED) Device
Application:
13/153,011 →
Publication:
US 2012/0306390
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 2, 2012
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 027974/0752 →
Merger
Dec 2, 2015
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037195/0793 →
Change of Name
Dec 2, 2015
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037457/0506 →