Patent Assignment
Reel/Frame 037195/0793
Merger
Recorded: 2015-12-02
Pages: 5
Assignor
CHIP STAR LTD.
Executed: 2015-07-15
Assignee
EPISTAR CORPORATION
5 LI HSIN 5TH RD., SCIENCE BASED INDUSTRIAL PARK, HSINCHU, TAIWAN
Covered Properties
(9)
Light-Emitting Devices with Through-Substrate Via Connections
Application:
12/704,974 →
Publication:
US 2011/0198609
Mechanisms for Anti-Flickering
Method and System for Adjusting Light Output from a Light Source
Architecture for Supporting Modulized Full Operation Junction Ultra High Voltage (UHV) Light Emitting Diode (LED) Device
Application:
13/153,011 →
Publication:
US 2012/0306390
Coated Diffuser Cap for Led Illumination Device
Light Emitting Diode with Improved Light Extraction Efficiency and Methods of Manufacturing Same
Application:
13/308,784 →
Publication:
US 2013/0140592
Led Illumination Apparatus with Improved Output Uniformity
Application:
13/366,063 →
Publication:
US 2013/0201669
LED Emitter with Improved White Color Appearance
High Voltage LED with Improved Heat Dissipation and Light Extraction
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 4, 2013
From: LEE, HSIAO-WEN; TSENG, CHI-XIANG; TANG, YU-SHENG; CHU, JUNG-TANG
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 029565/0077 →
Assignment of Assignor's Interest
Jan 6, 2014
From: HUANG, MING-HSIN
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 031893/0418 →
Change of Name
Dec 2, 2015
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037457/0506 →
Change of Name
Apr 22, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075513/0783 →