IP Library Granted Patent US 9,222,640
Granted Patent B2
US 9,222,640 · App. 13/275,550 · Granted Dec 29, 2015

Coated diffuser cap for LED illumination device

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Quick Facts
Patent No.
US 9,222,640
App. No.
13/275,550
Granted
Dec 29, 2015
Kind
B2
Abstract

The present disclosure provides an illumination device. The illumination device comprises a light-emitting diode (LED) device on a substrate, a heat sink and a cap. The heat sink is thermally connected to the LED device. The cap is secured over the substrate and covering the LED device. The cap includes a coating material having diffusion and reflection characteristics, and the coating material is free of being in direct contact with the LED device. The coating material is applied on a first portion of an inner surface of the cap, but not on a second portion of the inner surface of the cap.

Claims (36)

1. An illumination device comprising:

a light-emitting diode (LED) device on a substrate;

a heat sink thermally connected to the LED device;

a cap secured over the substrate and covering the LED device, wherein the cap includes a coating material that comprises both diffusion and reflection characteristics, and wherein the coating material is free of being in direct contact with the LED device, and wherein the coating material is applied on a first portion of an inner surface of the cap, and wherein a second portion of the inner surface of the cap is free of the coating material.

2. The illumination device of claim 1 , wherein a width of the cap is greater than a height of the cap.

3. The illumination device of claim 2 , wherein the cap has an inverted trapezoid shape that is smaller in size near the heat sink.

4. The illumination device of claim 3 , wherein the cap has a midpoint, such that the coating material is provided above the midpoint (farther from the heat sink), and is not provided below the midpoint (closer to the heat sink).

5. The illumination device of claim 2 , wherein the cap has an ellipsoid shape.

6. The illumination device of claim 2 , further comprising a lens positioned over the LED device and inside the cap.

7. The illumination device of claim 6 , wherein the lens includes a coating material that comprises both diffusion and reflection characteristics, and wherein the lens coating material has the same material composition as the cap coating material.

8. The illumination device of claim 7 , wherein the lens has a midpoint, such that the coating material is provided above the midpoint (farther from the heat sink), and is not provided below the midpoint (closer to the heat sink).

9. The illumination device of claim 1 , wherein the cap includes a diffusion lens and a coating material applied to an inner surface of the diffusion lens.

10. The illumination device of claim 9 , wherein the cap further includes a phosphor material applied to an inner surface.

11. The illumination device of claim 10 , wherein the coating material and phosphor material are combined in a single layer.

12. The illumination device of claim 9 , wherein the diffusion lens comprises at least one material selected from the group consisting of polycarbonate (PC) and poly methyl methacrylate (PMMA).

13. The illumination device of claim 12 , wherein the diffusion lens further comprises phosphor.

14. The illumination device of claim 1 , wherein the coating material includes TiO 2 to provide the reflection characteristics.

15. The illumination device of claim 14 , wherein the coating material includes a resin mixed with the TiO 2 .

16. The illumination device of claim 1 , wherein the cap has a spherical top with a relatively narrow neck portion extending to the heat sink, and wherein a width of the cap is less than a height of the cap.

17. A light bulb comprising:

a light-emitting diode (LED) device on a substrate;

a cap secured over the substrate and covering the LED device, wherein the cap has a spherical shape with a relatively narrow neck portion extending towards the LED device, wherein a width of the cap is less than a height of the cap; and

a diffusion lens that is disposed over the substrate and houses the LED device within, wherein the diffusion lens is disposed underneath the cap, and wherein a coating material is applied to a selected portion of an inner surface of the diffusion lens, wherein the selected portion is smaller than the inner surface;

wherein the diffusion lens comprises at least one material selected from the group consisting of polycarbonate (PC) and poly methyl methacrylate (PMMA); and

wherein the coating material includes a resin mixed with TiO2.

18. The light bulb of claim 17 further comprising a heat sink thermally connected to the LED device and proximate to the cap, wherein the heat sink has a height that is less than the height of the cap.

19. An illumination device comprising:

a light-emitting diode (LED) device on a substrate;

a heat sink thermally connected to the LED device;

a cap secured over the substrate and covering the LED device, wherein the cap includes a coating material that comprises both diffusion and reflection characteristics;

wherein:

a width of the cap is greater than a height of the cap;

the cap has an inverted trapezoid shape or an ellipsoid shape;

the coating material is applied on a selected segment of an inner surface of the cap, the selected segment being smaller than the inner surface; and

the coating material is spaced apart from the LED device by a gap.

20. The illumination device of claim 19 , wherein the segment is located above a midpoint of the inner surface and not below the midpoint of the inner surface.

Assignments (5)
CHANGE OF NAME Recorded Apr 22, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075513/0783 →
MERGER Recorded Dec 2, 2015
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037195/0793 →
CHANGE OF NAME Recorded Dec 2, 2015
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037457/0506 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 2, 2012
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 027974/0709 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 18, 2011
From: SUN, CHIH-HSUAN; YEH, WEI-YU; KO, PEI-WEN; FU, HSUEH-HUNG
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 027077/0372 →