Patent Assignment
Reel/Frame 026777/0417
Assignment of Assignor's Interest
Recorded: 2011-08-19
Pages: 2
Assignors
LEE, KUN-YU
Executed: 2011-08-17
YAO, LIANG-GI
Executed: 2011-08-17
OKUNO, YASUTOSHI
Executed: 2011-08-17
WANN, CLEMENT HSINGJEN
Executed: 2011-08-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Method of Fabricating a Carbon-Free Dielectric Layer Over a Carbon-Doped Dielectric Layer