Patent Assignment
Reel/Frame 026777/0473
Assignment of Assignor's Interest
Recorded: 2011-08-19
Pages: 2
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Methods of Fabricating Package Stack Structure and Method of Mounting Package Stack Structure on System Board