Patent Assignment
Reel/Frame 026794/0461
Assignment of Assignor's Interest
Recorded: 2011-08-23
Pages: 2
Assignors
YANG, KUO-PIN
Executed: 2011-08-05
HSIAO, WEI-MIN
Executed: 2011-08-09
HUNG, CHENG-HUI
Executed: 2011-08-05
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
NO. 26, CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE,, KAOHSIUNG CITY, TAIWAN
Covered Property
(1)
Carrier Bonding and Detaching Processes for a Semiconductor Wafer