IP Library › Assignment 026800/0494
Patent Assignment
Reel/Frame 026800/0494

Assignment of Assignor's Interest

Recorded: 2011-08-24 Pages: 4
Assignor
THIJSSEN, HENDRIKUS
Executed: 2009-03-17
Assignee
METALFORM ASIA PTE LTD.
50 YISHUN INDUSTRIAL PARK A, SINGAPORE, 768725, SINGAPORE
Covered Property (1)
Low Cost High Performance Injection Molded Hard Drive Top Cover
Patent: 8,995,119 →
Application: 13/203,099 →
Publication: US 2012/0092824
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 24, 2011
From: NARASIMHAN, SUDARSHAN
To: METALFORM ASIA THAILAND
Reel/Frame 026800/0603 →
Assignment of Assignor's Interest Aug 24, 2011
From: METALFORM ASIA THAILAND
To: METALFORM ASIA PTE LTD.
Reel/Frame 026800/0647 →
Merger Aug 24, 2011
From: METALFORM ASIA PTE LTD.
To: GSLBU SINGAPORE PTE LTD.
Reel/Frame 026800/0709 →
Change of Name Aug 24, 2011
From: GSLBU SINGAPORE PTE LTD.
To: MMI PRECISION FORMING PTE LTD.
Reel/Frame 026800/0894 →