Patent Assignment
Reel/Frame 026801/0433
Assignment of Assignor's Interest
Recorded: 2011-08-24
Pages: 8
Assignors
SINGH, SARAVJEET
Executed: 2011-07-15
EATON, BRAD
Executed: 2011-07-20
KUMAR, AJAY
Executed: 2011-07-15
LEI, WEI-SHENG
Executed: 2011-07-15
HOLDEN, JAMES M.
Executed: 2011-08-10
YALAMANCHILI, MADHAVA RAO
Executed: 2011-07-15
EGAN, TODD J.
Executed: 2011-07-13
Assignee
APPLIED MATERIALS, INC.
3050 BOWERS AVENUE, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Hybrid Laser and Plasma Etch Wafer Dicing Using Substrate Carrier