Patent Assignment
Reel/Frame 026802/0342
Assignment of Assignor's Interest
Recorded: 2011-08-24
Pages: 3
Assignors
LIN, CHUN-CHIEH
Executed: 2011-06-16
SU, HUNG-WEN
Executed: 2011-06-17
TSAI, MINGHSING
Executed: 2011-06-17
JANG, SYUN-MING
Executed: 2011-06-16
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Gap Filling Method for Dual Damascene Process