Patent Assignment
Reel/Frame 026827/0182
Assignment of Assignor's Interest
Recorded: 2011-08-30
Pages: 4
Assignees
UBE INDUSTRIES, LTD.
1978-96, OAZA KOGUSHI, UBE-SHI, 755-8633, JAPAN
RIKEN
2-1, HIROSAWA, WAKO-SHI, 351-0198, JAPAN
Covered Property
(1)
Composite Substrate for Formation of Light-Emitting Device, Light-Emitting Diode Device and Manufacturing Method Thereof