Patent Assignment
Reel/Frame 026850/0263
Assignment of Assignor's Interest
Recorded: 2011-09-02
Pages: 2
Assignors
YU, CHEN-HUA
Executed: 2011-07-20
TUNG, CHIH-HANG
Executed: 2011-07-20
SHAO, TUNG-LIANG
Executed: 2011-07-08
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Thermally Enhanced Structure for Multi-Chip Device