Patent Assignment
Reel/Frame 026853/0085
Assignment of Assignor's Interest
Recorded: 2011-09-02
Pages: 3
Assignor
OGANESIAN, VAGE
Executed: 2011-08-05
Assignee
CHINA WLCSP US, INC.
889 PERIWINKLE TERRACE, SUNNYVALE, CALIFORNIA, 94086
Covered Property
(1)
3D Integrated Microelectronic Assembly with Stress Reducing Interconnects and Method of Making Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.