Patent Assignment
Reel/Frame 026856/0324
Assignment of Assignor's Interest
Recorded: 2011-09-02
Pages: 5
Assignors
YOUN, HANSHIN
Executed: 2011-07-08
KWON, YONGHWAN
Executed: 2011-07-11
RO, YOUNGHOON
Executed: 2011-07-11
KIM, WOOJAE
Executed: 2011-07-11
PARK, SUNGWOO
Executed: 2011-07-08
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Package for Semiconductor Device Including Guide Rings and Manufacturing Method of the Same