Patent Assignment
Reel/Frame 026859/0327
Assignment of Assignor's Interest
Recorded: 2011-09-06
Pages: 4
Assignors
IWAKI, HIROYUKI
Executed: 2011-08-08
OGIWARA, TAKAFUMI
Executed: 2011-08-22
SAKAMOTO, TAKESHI
Executed: 2011-08-08
HOSHIKAWA, MASAHARU
Executed: 2011-08-09
ATSUMI, KAZUHIRO
Executed: 2011-08-08
KAWAGUCHI, DAISUKE
Executed: 2011-08-08
Assignee
HAMAMATSU PHOTONICS K.K.
1126-1, ICHINO-CHO, HIGASHI-KU, HAMAMATSU-SHI, SHIZUOKA, 435-8558, JAPAN
Covered Property
(1)
Method of Cutting Object to Be Processed