Patent Assignment
Reel/Frame 026861/0188
Assignment of Assignor's Interest
Recorded: 2011-09-06
Pages: 2
Assignors
YU, CHEN-HUA
Executed: 2011-08-10
SHEU, LAWRENCE CHIANG
Executed: 2011-08-10
TSAI, HAO-YI
Executed: 2011-08-10
LEE, CHIEN-HSIUN
Executed: 2011-08-08
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Solder Ball Protection Structure with Thick Polymer Layer