Patent Assignment
Reel/Frame 026888/0602
Assignment of Assignor's Interest
Recorded: 2011-09-12
Pages: 4
Assignors
SHAO, TUNG-LIANG
Executed: 2011-07-08
TUNG, CHIH-HANG
Executed: 2011-07-20
YU, CHEN-HUA
Executed: 2011-07-20
TSAI, HAO-YI
Executed: 2011-07-08
LII, MIRNG-JI
Executed: 2011-08-17
SHIH, DA-YUAN
Executed: 2011-08-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Apparatus and Methods for Forming Through Vias