Patent Assignment
Reel/Frame 026895/0044
Assignment of Assignor's Interest
Recorded: 2011-09-12
Pages: 3
Assignors
KANG, TAE-HO
Executed: 2011-08-31
KIM, JIN-HO
Executed: 2011-08-31
KIM, BO-SEONG
Executed: 2011-08-31
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Multi-Chip Package and Method of Manufacturing Thereof