Patent Assignment
Reel/Frame 026898/0782
Assignment of Assignor's Interest
Recorded: 2011-09-13
Pages: 2
Assignor
HANABE, MITSUHIRO
Executed: 2011-08-08
Assignee
SONY CORPORATION
1-7-1 KONAN, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Package Substrate, Module and Electric/Electronic Devices Using the Same