Patent Assignment
Reel/Frame 026903/0145
Assignment of Assignor's Interest
Recorded: 2011-09-14
Pages: 2
Assignor
SONG, JIK-HO
Executed: 2011-08-16
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, KOREA, REPUBLIC OF
Covered Property
(1)
Printed Circuit Board Having Hexagonally Aligned Bump Pads for Substrate of Semiconductor Package, and Semiconductor Package Including the Same