Patent Assignment
Reel/Frame 026905/0368
Assignment of Assignor's Interest
Recorded: 2011-09-14
Pages: 3
Assignor
JIN, YONGGANG
Executed: 2011-09-14
Assignee
STMICROELECTRONICS PTE LTD.
28 ANG MO KIO INDUSTRIAL PARK 2, SINGAPORE, 569508, SINGAPORE
Covered Property
(1)
Semiconductor Package with Improved Pillar Bump Process and Structure
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.