IP Library Assignment 026908/0102
Patent Assignment
Reel/Frame 026908/0102

Assignment of Assignor's Interest

Recorded: 2011-09-14 Pages: 3
Assignors
PALMATEER, LAUREN
Executed: 2005-07-12
CUMMINGS, WILLIAM J.
Executed: 2005-06-29
GALLY, BRIAN J.
Executed: 2005-06-27
MILES, MARK W.
Executed: 2005-07-05
SAMPSELL, JEFFREY B.
Executed: 2005-06-28
CHUI, CLARENCE
Executed: 2005-06-28
KOTHARI, MANISH
Executed: 2005-06-29
Assignee
IDC, LLC
2415 THIRD AVE, SAN FRANCISCO, CALIFORNIA, 94107
Covered Property (1)
Method and Device for Packaging a Substrate
Patent: 8,682,130 →
Application: 13/231,640 →
Publication: US 2012/0002266
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 14, 2011
From: IDC, LLC
To: QUALCOMM MEMS TECHNOLOGIES, INC.
Reel/Frame 026908/0162 →
Assignment of Assignor's Interest Aug 31, 2016
From: QUALCOMM MEMS TECHNOLOGIES, INC.
To: SNAPTRACK, INC.
Reel/Frame 039891/0001 →