Assignment of Assignor's Interest

Recorded: 2011-09-14 Pages: 16

Assignor

IDC, LLC

Executed: 2009-09-25

Assignee

QUALCOMM MEMS TECHNOLOGIES, INC.

5775 MOREHOUSE DRIVE, SAN DIEGO, CALIFORNIA, 92121

Covered Property (1)

Method and Device for Packaging a Substrate

Patent: 8,682,130 →

Application: 13/231,640 →

Publication: US 2012/0002266

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.