Patent Assignment
Reel/Frame 026918/0833
Assignment of Assignor's Interest
Recorded: 2011-09-16
Pages: 3
Assignee
GLOBALFOUNDRIES SINGAPORE PTE. LTD.
60 WOODLANDS INDUSTRIAL PARK D STREET 2, SINGAPORE, 738406, SINGAPORE
Covered Property
(1)
Damascene Process for Aligning and Bonding Through-Silicon-via Based 3D Integrated Circuit Stacks
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.