Patent Assignment
Reel/Frame 026923/0440
Assignment of Assignor's Interest
Recorded: 2011-09-17
Pages: 6
Assignors
CHOI, EUN-KYOUNG
Executed: 2011-08-29
JEONG, SE YOUNG
Executed: 2011-08-29
CHOI, KWANG-CHUL
Executed: 2011-08-29
MIN, TAE HONG
Executed: 2011-08-29
LEE, CHUNGSUN
Executed: 2011-08-29
KIM, JUNG-HWAN
Executed: 2011-08-29
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Packages and Methods of Fabricating the Same