Patent Assignment
Reel/Frame 026926/0738
Assignment of Assignor's Interest
Recorded: 2011-09-19
Pages: 5
Assignors
LEE, JAE GON
Executed: 2011-08-31
PARK, BONG IL
Executed: 2011-08-31
KANG, MOO KYUNG
Executed: 2011-08-31
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Hierarchical Power Management Circuit, Power Management Method Using the Same, and System on Chip Including the Hierarchical Power Management Circuit