Patent Assignment
Reel/Frame 026949/0530
Assignment of Assignor's Interest
Recorded: 2011-09-22
Pages: 2
Assignors
IM, YUN-HYEOK
Executed: 2011-09-17
KIM, JONG-YEON
Executed: 2011-09-19
CHO, TAE-JE
Executed: 2011-09-19
KANG, UN-BYOUNG
Executed: 2011-09-18
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU,, GYEONGGI-DO,, SUWON-SI,, KOREA, REPUBLIC OF
Covered Property
(1)
Bump Structure Including Nano-Wires and a Body Connecting Ends of the Nano-Wires, Semiconductor Package Having the Bump Structure and Method of Manufacturing the Semiconductor Package