Assignment of Assignor's Interest

Recorded: 2011-09-23 Pages: 4

Assignors

YAMAGUCHI, HARUHIKO

Executed: 2011-08-30

FUKUDA, YOSHIYUKI

Executed: 2011-08-30

Assignees

KABUSHIKI KAISHA TOSHIBA

1-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, 105-8001, JAPAN

TOSHIBA MATERIALS CO., LTD.

8, SHINSUGITA-CHO, ISOGO-KU, YOKOHAMA-SHI, KANAGAWA-KEN, 235-0032, JAPAN

Covered Property (1)

Aluminum Nitride Substrate, Aluminum Nitride Circuit Board, Semiconductor Apparatus, and Method for Manufacturing Aluminum Nitride Substrate

Patent: 8,791,566 →

Application: 13/259,222 →

Publication: US 2012/0038038

Related Assignments (3)

Other recorded transfers of the patent in this record — the chain of ownership.