Patent Assignment
Reel/Frame 026963/0631
Assignment of Assignor's Interest
Recorded: 2011-09-25
Pages: 4
Assignors
KANG, UN-BYOUNG
Executed: 2011-09-20
CHOI, KWANG-CHUL
Executed: 2011-09-20
KIM, JUNG-HWAN
Executed: 2011-09-20
MIN, TAE HONG
Executed: 2011-09-20
Assignee
SAMSUNG ELECTRONIC CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Heterojunction Structures of Different Substrates Joined and Methods of Fabricating the Same