Patent Assignment
Reel/Frame 026987/0866
Assignment of Assignor's Interest
Recorded: 2011-09-23
Pages: 3
Assignors
KIM, HYUN-KI
Executed: 2011-09-07
CHOI, DAE-YOUNG
Executed: 2011-09-07
KIM, MI-YEON
Executed: 2011-09-08
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Printed Circuit Board Having Different Sub-Core Layers and Semiconductor Package Comprising the Same