Patent Assignment
Reel/Frame 026996/0932
Assignment of Assignor's Interest
Recorded: 2011-09-23
Pages: 3
Assignors
KIM, YONG-HOON
Executed: 2011-09-06
LEE, HEE-SEOK
Executed: 2011-09-06
SHIN, SEONG-HO
Executed: 2011-09-06
YOU, SE-HO
Executed: 2011-09-06
LEE, YUN-HEE
Executed: 2011-09-06
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Stacked Package Structure Including Insulating Layer Between Two Stacked Packages