Patent Assignment
Reel/Frame 026997/0688
Assignment of Assignor's Interest
Recorded: 2011-09-27
Pages: 17
Assignors
SATO, HIROAKI
Executed: 2011-08-04
HASHIMOTO, KIYOAKI
Executed: 2011-08-04
NAKADAIRA, YOSHIKUNI
Executed: 2011-08-04
MASUDA, NORIHITO
Executed: 2011-08-04
HABA, BELGACEM
Executed: 2011-09-07
MOHAMMED, ILYAS
Executed: 2011-09-12
DAMBERG, PHILIP
Executed: 2011-09-12
Assignee
TESSERA, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Chip with Sintered Connections to Package
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →