Patent Assignment
Reel/Frame 026998/0164
Assignment of Assignor's Interest
Recorded: 2011-09-30
Pages: 2
Assignors
CHANG, CHIH-HORNG
Executed: 2011-09-21
KUO, TIN-HAO
Executed: 2011-09-21
CHEN, CHEN-SHIEN
Executed: 2011-09-21
LIN, YEN-LIANG
Executed: 2011-09-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Bump Structures