IP Library Assignment 026999/0001
Patent Assignment
Reel/Frame 026999/0001

Merger

Recorded: 2011-09-30 Pages: 3
Assignor
Assignee
UNIMICRON TECHONOLOGY CORP.
38 HSING PONG RD., KWEI SAN INDUSTRIAL ZONE, TAOYUAN, TAIWAN
Covered Property (1)
Packaging Substrate Structure and Manufacturing Method Thereof
Patent: 8,058,566 →
Application: 12/163,579 →
Publication: US 2009/0000813
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 27, 2008
From: HSU, SHIH-PING
To: PHOENIX PRECISION TECHNOLOGY CORPORATION
Reel/Frame 021164/0567 →