Patent Assignment
Reel/Frame 027003/0996
Assignment of Assignor's Interest
Recorded: 2011-10-03
Pages: 3
Assignors
LIN, WEN-YI
Executed: 2011-09-27
YEW, MING-CHIH
Executed: 2011-09-27
LIN, PO-YAO
Executed: 2011-09-27
LU, JING RUEI
Executed: 2011-09-27
WU, JIUN YI
Executed: 2011-09-27
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Package on Packaging Structure and Methods of Making Same